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Conductive molybdenum disc molybdenum round plate
Item: Conductive Molybdenum Disc Wafer
Standard: ASTM B387
Grade: Mo1, TZM, MLa
Density: 10.2g/cm3
Purity: 99.95% min.
Size: User's demand
Surface: User's demand
Using temperature: Mo1, TZM: 1300-1400℃ MLa: 1700-1900℃
Chemical requirements
Element | Ni | Mg | Fe | Pb | Al | Bi | Si | Cd | Ca | P |
Concentration(%) | 0.003 | 0.002 | 0.005 | 0.0001 | 0.002 | 0.0001 | 0.002 | 0.0001 | 0.002 | 0.001 |
Element | C | O | N | Sb | Sn | Mo | ||||
Concentration(%) | 0.01 | 0.003 | 0.003 | 0.0005 | 0.0001 | balance |
Feature
1. Low thermal expansivity
2. High using temperature
3. Good corrosion resistence
4. High strength
5. Low electrical resistivity
6. Manufacturing based on customer’s request
Application
1. High power transister heat shield
2. Substrate and heat sink of silicon rectifier
3. Can also be used in high temperature furnace and glass industries, etc.