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Conductive molybdenum disc molybdenum round plate


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Item: Conductive Molybdenum Disc Wafer


Standard: ASTM B387


Grade: Mo1, TZM, MLa


Density: 10.2g/cm3


Purity: 99.95% min.


Size: User's demand


Surface: User's demand


Using temperature: Mo1, TZM: 1300-1400℃ MLa: 1700-1900


Chemical requirements 























































ElementNiMgFePbAlBiSiCdCaP
Concentration(%)0.0030.0020.0050.00010.0020.00010.0020.00010.0020.001
ElementCONSbSn Mo   
Concentration(%)0.010.0030.0030.00050.0001 balance    

 


Feature


1. Low thermal expansivity


2. High using temperature


3. Good corrosion resistence


4. High strength


5. Low electrical resistivity


6. Manufacturing based on customer’s request


 


Application


1. High power transister heat shield


2. Substrate and heat sink of silicon rectifier


3. Can also be used in high temperature furnace and glass industries, etc.


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