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Base material | FR4,High-TG FR4,CEM3,aluminum, High Frequency frequency(Rogers,Taconic,Aron,PTFE,F4B) |
Layers | 1-4 Layers(Aluminum), 1-32 layers(FR4) |
Max Panel | 1550mm*800mm |
Copper Thickness | 0.5oz, 1oz, 2oz, 3oz,4oz |
Dielectric Thickness | 0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm |
board Core Thickness | 0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm |
Board Thickness | 0.4mm - 4.0mm |
Thickness Tolerance | +/-10% |
Aluminum Machining | Drilling, Tapping, Milling, Routing, Die-Punching, Break-off tab available |
Min Hole | 0.2 mm |
Max Working Voltage | 2.5kVDC(0.075mm Dielectric), 3.75kVDC (0.15mm Dielectric) |
Min Track Width | 0.2mm (8mil) |
Min Track Gap | 0.2mm (8mil) |
Min SMD Pad Pitch | 0.2mm (8mil) |
Surface Finishing | HASL lead-free, ENIG, Plated Gold, Immersion Gold, OSP |
Solder Mask Color | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
Legend Color | Black, White, etc |
E-test | Yes |
Rohs, UL | Yes |
Reference Standard | IPC-A-600G Class 2 |
SMT | Position accuracy:20 um Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP Max. component height::25mm Max. PCB size:680×500mm Min. PCB size:no limited PCB thickness:0.3 to 6mm PCB weight:3KG Max. PCB width:450mm |
Wave-Solder | Min. PCB width: no limited Component height:Top 120mm/Bot 15mm Metal type :part, whole, inlay, sidestep Metal material:Copper , Aluminum |
Sweat-Solder | Surface Finish:plating Au, plating sliver , plating Sn Air bladder rate:less than 20% |
Press-fit | Press range:0-50KN Max. PCB size:800X600mm |
Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
board layers | like 2 layers, 4 layers, 6layers, we check according to gerber |
Material | FR4,tg135,tg150; if no requirement, we usually choose tg135 or tg150 |
Board Thickness | like 1.2mm, 1.6mm, default tolerance +10%,-10% |
Surface finish | e.g. Immersion Gold(AU:2u"), HASL Lead Free |
Single Size | e.g. 66*65mm |
Panel size length | e.g. 132mm |
Panel size width | e.g. 140mm |
copper thickness | if no requirement, in default 1oz |
soldermask color | if no requirement, in default green |
soldermask sides | in default both sides |
silkscreen color | in default white |
silkscreen sides | According to the gerber |
min drill hole | According to the gerber |
hole wall thickness | According to the gerber |
min line width | According to the gerber |
min line space | According to the gerber |
cross board | if no requirement,in default 10% x-out/cross board |
manufaturer's logo | if no requirement we decide, we may add logo, may not |
UL Logo | if no requirement, we decide, we may add yaxinda UL, may not add UL if not convenient. |
week year format | like:WWYY or YYWW, if no requirement, we decide by ourself |
E-Test Stamp | We do e-test for all products; if no special requirement, we may not add the stamp or silkscreen print on the board; |
Package requirment | if no requirement, we choose normal package. |
shipment report | if no requirement, we decide, usually Sliced solder sheet plus full set of report, COC material certificate |
Inspection standard | IPC Class II in default |
Lead Time | check quotation sheet; usually 7-30 working days for most orders after confirmed EQ; For urgent orders, 3-5 days |
Complex boards | If flexible,rigid-flex,alumminum,ceramics,multi-layer over 10, HDI,min line width/spacing smaller than 4mil, board thickness too thick or thin, special techniques, it takes longer time and higher price. |