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Base Material | Fiberglass Epoxy |
Surface Finishing | Immersion gold |
Product name | Printed Circuit Board |
Application | Electronics Device |
Keywords | Blank Pcb Board |
Dielectric | FR-4 |
Flame Retardant Properties | V0 |
Base Material | Copper |
Processing Technology | Electrolytic Foil |
Insulation Materials | Vacuum Packing |
CIRCUITS (Design for manufacturing capability)-Flex | ||||||||
Item | Name | limit capability(sample) | limit capability(small-medium volume) | |||||
1 | Material | FCCL (adhesive) | Shengyi SF302:PI=0.5mil,1mil and 2mil; Cu=0.33oz,0.5oz and 1oz | Shengyi SF302:PI=0.5mil,1mil and 2mil; Cu=0.33oz,0.5oz and 1oz | ||||
2 | FCCL (adhesiveless) | PI=1mil,2mil; Cu=2oz | Panasonic R‐F775:PI=1mil and 2mil; Cu=0.33oz, 0.5oz and 1oz | |||||
3 | PI=1mil, 2mil, 3mil and 4mil; Cu=2oz | DuPont Pyralux AP:PI=1mil, 2mil and 3mil; Cu=0.33oz, 0.5oz and 1oz | ||||||
4 | Coverlay | Shengyi SF302C: 0515, 1025 and 2030 | Shengyi SF302C: 0515, 1025 and 2030 | |||||
5 | Taiflex FHK: 0515,1025 and 2035 | Taiflex FHK: 0515,1025 and 2035 | ||||||
6 | Adhesive | Taiflex BT: AD=10um, 25um and 40um | Taiflex BT: AD=10um, 25um and 40um | |||||
7 | PI stiffener | Taiflex MHK: PI=3mil, 5mil, 7mil and 9mil | Taiflex MHK: PI=3mil, 5mil, 7mil and 9mil | |||||
8 | 3M | 9460, 6677, 9458, 468 | 9460, 6677, 9458, 468 | |||||
9 | Others | Layer | 5‐8 | 1‐4 | ||||
10 | Board thickness (without stiffener) | 0.6‐0.8mm | 0.1‐0.5mm | |||||
11 | Tolerance of single layer | ±0.03mm | ±0.03mm | |||||
12 | Tolerance of double layer(≤0.3mm) | ±0.03mm | ±0.05mm | |||||
13 | Tolerance of multi‐layer(<0.3mm) | ±0.03mm | ±0.05mm | |||||
14 | Tolerance of multi‐layer (0.3mm‐0.8mm) | ±10% | ±0.1mm | |||||
15 | Tolerance of board thickness (including PI stiffener) | ±10% | ±0.05mm | |||||
16 | Tolerance of board thickness (including FR4 stiffener) | ±10% | ±0.1mm | |||||
17 | Min. board size | 5mm*10mm(without birdge);10mm*10mm(with bridge) | 5mm*10mm(without birdge);10mm*10mm(with bridge) | |||||
18 | Max. board size | 220mm*400mm | 220mm*350mm | |||||
19 | Min. coverlay bridge | 8mil | 8mil | |||||
20 | Inner layer | Min. line width/spacing (12/18um copper) | 2.5/2.5mil(loop lines 4/4mil) | 3/3mil(loop lines 5/5mil ) | ||||
21 | Min. line width/spacing (35um copper) | 3/3mil(loop lines 5/5mil) | 3.5/3.5mil(loop lines 6/6mil) | |||||
22 | Min. line width/spacing (70um copper) | 5/7mil(loop lines 7/9mil) | 6/8mil(loop lines 8/10mil) | |||||
23 | Max. copper thickness | 3oz | 2oz | |||||
24 | Outer layer | Min. line width/spacing (18um copper) | 2.5/2.5mil(loop lines 4/4mil) | 3/3mil(loop lines 6/6mil) | ||||
25 | Min. line width/spacing (35um copper) | 3.5/3.5mil(loop lines 7.5/7.5mil) | 4/4mil(loop lines 8/8mil) | |||||
26 | Min. line width/spacing (70um copper) | 5.5/8.5mil(loop lines 9.5/12.5mil) | 6/9mil(loop lines 10/13mil) | |||||
27 | Min. line width/spacing (105um copper) | 9.5/12.5mil(loop lines 11.5/14.5mil) | 10/13mil(loop lines 12/15mil) | |||||
28 | Max. finished copper thickness | 3oz | 2oz | |||||
29 | Drilling | Min.distance between via and conductors | 5mil (<4 layer) | 6mil (<4 layer) | ||||
30 | 7mil (4~6 layer ) | 8mil (4~6 layer ) | ||||||
31 | 10mil (7‐8 layer ) | 12mil (7‐8 layer ) | ||||||
32 | Min. mechanical drill hole | 4mil | 6mil | |||||
33 | Solder mask and silk screen | Solder mask color | green | green | ||||
34 | Min. solder dam (base copper ≤1oz) | 4mil(green), 8.0mil(solder dam on the large copper) | 4mil(green), 8.0mil(solder dam on the large copper) | |||||
35 | Min. clearance | 3mil(part for 2.5mil) | 3mil(part for 2.5mil) | |||||
36 | Silk color | white, yellow | white, yellow | |||||
37 | Surface treatment | Surface treatment | HASL ,ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold,Hard gold, Immersion silver and OSP | HASL ,ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold, Hard gold, Immersion silver and OSP | ||||
38 | Routing | Laser accuracy | ±0.05mm | ±0.05mm | ||||
39 | Punching accuracy | ±0.05mm ‐ ±0.15mm | ±0.05mm ‐ ±0.15mm |