Индивидуальный поставщик FPC гибкая печатная плата с креплением
- Категории: FPC >>>
- Поставщик: Shenzhen,Danyu,Electronics,Co.,Ltd.
Поделиться:
Описание и отзывы
Характеристики
Product Description
About Us
Founded in 2006, as a professional manufacturer of circuit board in China, all of people in Best Technology are working together to make our vision come true. Engaging in global market with 1200+ customers in more than 60 countries & areas, we always reply email within 12 hours so that make you feeling like doing business with your neighbor. Focusing on electronics & circuit board industry, we provide one-stop service from designing, DFM, fabrication of all type of flex circuits board (from 1 layer, dual access, 2L, Multi-layer FPC, Rigid-flex circuits), to components purchasing, FPCBA (flex circuit board assembly) and box assembly, we also provide suitable solution for our customers that help to save time & money of them, and then become the most reliable partner of them.
Manufacturing Capability
Item | Capabilities |
Layer Count | 1 - 30 Layers |
Max Board Dimension | 1L:500*2000mm; 2L:250*1380mm |
Min Board Thickness | 0.05mm |
Max Board Thickness | 3.0mm |
Conductor Thickness | 1/3 OZ(12 um) - 4OZ(140um) |
Min Line Width/Line Space | 2/2mil (0.05/0.05mm) |
Min Hole Diameter | 4mil (0.10mm) |
Min Hole Spacing | NPTH:16mil (0.4mm); PTH:20mil(0.5mm) |
Min PAD Ring(Single) | 3mil (0.075mm) |
PTH Wall Thickness | 0.59mil (15um) |
Min Solder PAD Dia | 10mil (0.25mm) |
Min Soldermask Bridge | 12mil (0.30mm) |
Min BAG PAD Margin | 12mil (0.30mm) |
PTH/NPTH Dia Tolerance | PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm) |
Hole Position Deviation | ±4mil (0.10mm) |
Outline Tolerance | Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm |
Max Aspect Ratio | 8:01 |
Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG |
Impedance Controlled | Value>50ohm: ±10%; Value≤50ohm: ±5 ohm |
FAQ
1.How does FPC control the thickness of plated copper and hole copper?
Generalythe thickness ratio of plated copper and nole copper is 1:1.5 such as platea copper 6~8um, noe copper wilreach 10~15um; Loca copper plating is not acceptable.
2.What are the base material? What's the difference between Pl and PET materials?
Materials: Polyimide (Pl)and Polvester (PET)
Temperature resistance is different, Pl operating temperature can reacn130 degrees Celsius, the highest can withstand 250 degrees Celsius; PEToperating temperature is only 50 degrees Celsius, the nignest can withstand 105 degrees; FPC’s common material is PI
Temperature resistance is different, Pl operating temperature can reacn130 degrees Celsius, the highest can withstand 250 degrees Celsius; PEToperating temperature is only 50 degrees Celsius, the nignest can withstand 105 degrees; FPC’s common material is PI
3.What are the common thicknesses of cover layer?
The cover layer includes adhesive, like 50um cover layer
(25umPl+25um adhesive), 27.5um cover laver (12.5um Pl+15um adhesive
(25umPl+25um adhesive), 27.5um cover laver (12.5um Pl+15um adhesive
4.What are the common surface treatments of FPC?
ENIG, Gold plating, OSP, Immersion silver, ENEPIG (can't do HASL)
5. What are the types of FPC stiffener?
PI stiffener, thickness selection:
0.075mm,0.1mm, 0.125mm, 0.15mm ,0.175mm, 0.2mm, 0.225mm, 0.25mm FR4 stiffener thickness se ection:
0.1mm,0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm~1.6mm
0.075mm,0.1mm, 0.125mm, 0.15mm ,0.175mm, 0.2mm, 0.225mm, 0.25mm FR4 stiffener thickness se ection:
0.1mm,0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm~1.6mm
Advantage
Main Equipment
Customer Visit
Customer Evaluation
Package & Shipment
Похожие товары
Новинки - Розница
