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Item | Aluminum Production Capability |
Base Material | Aluminum |
Layers | 1-2 |
Finised inner/outer copper thickness | 1-2OZ |
Finished board thickness | 0.2-3.0mm |
Thermal Conductivity | 0.5/1/1.5/2W/m.K |
Minimum Size | 1500mm 1Layer |
Controlled Impedance | +/-5% |
Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
Surface treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP… |
Specification of alumlmum substrate plate:1 W/m.K | ||||||
item | Test Method | Units | Index | |||
Insulation thickness | IPC-TM-6502.2 18.1 | PM | 100 | |||
Thermal Stress | IPC-TM-650 2.413.1 | S | 288°C>120S | |||
Peel Strength | IPC-TM-6502.4 8.1 | N/mm | 1.5 | |||
Withstand voltage | DC | KV | Grinding plate:1.2 Oxidation:1.5 | |||
Break-down Voltage | AC | KV | 3 | |||
CTI | GB/T 4207 | V | 575 | |||
Glass Transition Temperature | IPC-TM-6502.425 | °C | 130 | |||
CTE(TMA) | IPC-TM-650 2.4 24 | %(50-260°C) | 0.5 | |||
Surface Resistance | IPC-TM-6502.6 17.1 | MQ | 4.18x103 | |||
Volume Resistance | IPC-TM-650 2.6 17.1 | MQcm | 3.27x107 | |||
Dielectric Constant 1 MHZ | IPC-TM-650 2.6 5.9 | / | / | |||
Dissipation Factor 1 MHZ | IPC-TM-650 2.6 5.9 | / | / | |||
Water Absorption | IPC-TM-6502.62.1 | % | <0.5 | |||
Thermal Conductivity | ASTM E 1464 | W/m-k | 1.3 | |||
Heat Resistance | / | °C/W | 0.7-0.9 | |||
Flammabiity | UL 94 Vertical Law | S | t1:0,t2:0 |