Автоматическая алмазная пила для силиконовой


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AUTOMATIC


Dicing Saw 


MDQS3260/3380


MDZD36120


 


 


Dicing saw mdzd36120.jpgDicing saw mdqs3380.jpgDicing saw mdqs3260.jpg


 


 


 


Application:


   


IC,LED,Solar cell,optical glass,optical fibre.


Ceramic, silicon wafer, QFN,BGA,PCB,GaAs,GaP.


Quarts,Lithium tantalum, sensitive resistor materials.


 


 


Principle and character:


>MDQS3260 for  6” or 245*164mm MDQS3380 for 8” or 260*260mm sq. and MDZD36120 for 12” workpiece.


>Automatically cutting, automatic alignment, automatic focus, automatic kerf check, and other image recognition functions.


>Placed on and removed from the chuck table by hand.


>Easy of use, it provided a Graphical User Interface(GUI) system by LCD touch screen.


>Real-time display the process status.


>With bridge shape structure can reduce the vibration and improve stability and cut quality.


>Shaft lock for easier blade changing.


>High quality component like spindle as well as guide screw etc.


>Customize fully automatic dicing saw(including unloading from cassette and unloading to cassette).


 


 


 


Specification:


 






















































































































































 



 



MDQS3260



MDQS3380



MDZD36120



Workpiece size



mm



6’’ or 156*156mm



8’’ or 260*260



8’’ or 12’’ 300*300



X-axis



cutting range(mm)



245



260



300



 



cutting speed(mm/s)



0.01-400



0.01-500



0.1-600



Y-axis



cutting range(mm)



165



260



300



 



single error(mm)



0.003



0.002



0.003



 



total error(mm)



0.005/160



0.003/260



0.003/200



Z-axis



Max.stroke(mm)



20



30



20



 



blade size(mm)



d50-d63.4



d50-d63.4



d50-d58



 



repeatability(mm)



0.003



0.002



0.002



θ- axis



rotating angle(deg)



320



380



380



Spindle



output(kW)



1.5



1.8



1.8



 



speed(rpm)



3000-60000



0-60000



6000-60000



Align system



magnification



150X



150X



150X



 



display



15’’ touch screen



17’’ touch screen



17’’ touch screen



Power



 



AC 3*380V+-10%



Air source



pressure(MPa)



0.5-0.8



 



consumption(L/min)



300



Water



cutting area(L/min)



3



 



main spindle cutting


(L/min)



1.5



Dimension



mm



602*888*2060



1080*1040*1900



1080*1040*1990



Weight



kg



550



990



1020



 


 


Accessary:  ceramic/metal chuck table, blade,blade maintain plate…….


 


 Dicing saw accessary


  


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See more Chinese machine on semiconductor industry please see below links:


 


http://minder-hightech.en.alibaba.com/productgrouplist-802634918/Semiconductor_Industry.html


 


 


 



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