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The Sn99Ag0.3Cu0.7 lead free solder wire is made up of 99.7% tin 0.3%silverand 0.7% copper. It is desirable for use in common metal equipment, copper tubes, and copper plates. This product is a conventional type of environmentally-friendly solder by adoption of lead-free soldering technology. Its wire diameter can reach more than 0.2mm.
As a typical type of high-temperature lead free tin wire, our Sn99Ag0.3Cu0.7 lead free solder has the melting point of approximately 227 degrees Celsius. It is suitable for both wave soldering and dip soldering processes, which call for environmental protection. During the soldering process, this product features nice liquidity. It can substantially reduce various technical problems, such as bridging, icicle, solder spatter, and more.
This product gives wide applications in the eco-friendly electronics assembly industry. It can be also used to fix the silicone toys.
Description | |
| melting point: 217℃, dia >=0.1mm |
melting point: 222℃, dia >=0.8mm | |
Sn97Ag3 | melting point: 222℃, dia >=0.8mm |
| melting point: 217℃, dia >=0.25mm |
Sn99Ag0.5Cu0.5 | melting point: 227℃, dia >=0.25mm |
| melting point: 227℃, dia >=0.3mm |
Sn97Cu3 | melting point: 227℃, dia >=0.3mm |
Sn42Bi58 (solid) | melting point: 138℃, dia >=0.3mm |
Sn42Bi58 (flux cored) | melting point: 138℃, dia >=1.0mm |
Sn42Bi57Ag1 (solid) | melting point: 138℃, dia >=0.3mm |
Sn42Bi57Ag1 (flux cored) | melting point: 138℃, dia >=1.0mm |
Sn42Bi57.6Ag0.4(flux cored) | melting point: 138℃, dia >=0.8mm |
| melting point: 232℃, dia >=1.0mm |
| melting point: 250℃, dia >=0.4mm |
| melting point: 240℃, dia >=0.5mm |
5. Other Solder Products:
SOLDER PASTE SOLDER BAR SOLDER POWDER
8. Cetification: