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☛ Automatic soldering ,desoldering and mounting , automatic pick up chip when desoldering completed.
☛ Chip auto feeding system enabled.
☛ Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed.
☛ HD CCD Optical Alignment system for precisely mounting BGA and Components. CCD lens auto folding & streching.
☛ Independent MITSUBISHI PLC inside to control movements, movement more stable and accurate.
☛ Laser Positioning for Fast Positioning BGA Chip and motherboard.
☛ BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.
☛ Equipped with top air flow adjust button, to meet the demands of tiny chips.
☛ Superior Safety Functions, with Emergency protection.
☛ User-friendly operation, Multi-functional ergonomic system.
Specifications | ||||||
1 | Total power | 5400w | ||||
2 | 3 independent heaters | Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w | ||||
3 | Voltage | AC220V±10% 50/60Hz | ||||
4 | Electric parts | 7'' touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning | ||||
5 | Temperature control | K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃. | ||||
6 | PCB positioning | V-groove + universal fixture + movable PCB shelf | ||||
7 | Applicable PCB size | Max 370x410mm Min 22x22mm | ||||
8 | Applicable BGA size | 1*1mm~80*80mm | ||||
9 | Dimensions | 600x700x850mm (L*W*H) | ||||
10 | Net weight | 74 Kg |
Independent Japan original MITSUBISHI PLC control
Top heater/mounting head/CCD lens movement more stable and accurate.
Packaging | ||
Size | 820 (L) * 870(W) * 870(D) mm | |
G.W. | 117 Kg | |
Packaging Details |
Delivery | ||
◆ Shipping By DHL, FedEx, TNT, EMS, UPS express. You can also choose sea shipment. |