Поделиться:
Quantity | Prototype & Volume PCB Assembly |
Type of Assembly | SMT and Thru-hole |
Solder Type | Water soluble solder paste, leaded and lead free |
Components | Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers / CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days service |
Bare Board Size | Smallest : 0.25*0.25 Inches; Largest:20*20 Inches |
File Format | Bill of Materials(BOM) Gerber files Pick-N-Place File(XYRS) |
Type of Service | Turn-key, Partial Turn-key or consignment |
Component Packaging | Cut Tape Tube Reels Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test XRAY Inspection ,AOI Test |
PCB + Assembly Process | Drilling-----Exposure----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----WaveSoldering ----.Assembling-----ICT-----Function Testing-----Temperature & HumidityTesting |
Layers | From single-sided to 12+ layers |
Copper Thickness | 0.5-6 OZ |
Material | FR4 (Shengyi China, ITEQ, KB A+, HZ), HI-TG, FR06, Rogers, Taconic, Argon, Nalco, Isola and so on |
Solder Mask | green, yellow, white, blue, black, red and so on |
Finished Surface | Conventional HASL, lead free HASL, ENIG、Immersion gold(Hard Gold、Soft Gold)、Immersion Silver、Silver Plating、Lead free 、HASL)、Immersion Tin、Tin Plating、OSP、Carbon、Platinum、ENENIG... |
Silkscreen color | white, black |
Products Type | HF(High-Frequency)&(Radio Frenquency)board, impendance controlled board, HDI board, BGA&Fine pitch board |
Min. line width/gap | 3.5/4mil(laser drill) |
Min. hole size | 0.15mm(mechanical drill)/4mil(laser drill) |
Min. Annlar Ring | 4mil |
Max Copper thickness | 6OZ |
Min Solder Mask Bridge | 0.08mm |
Plugging Vias capability | 0.2-0.8mm |