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Layers: | Mass production: 2~58 layers / Pilot run: 64 layers | ||||||
Max. Thickness: | Mass production: 394mil (10mm) / Pilot run: 17.5mm | ||||||
Material: | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc. | ||||||
Min. Width/Spacing: | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) | ||||||
Max. Copper Thickness: | UL certificated: 6.0 OZ / Pilot run: 12OZ | ||||||
Min. Hole Size: | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) | ||||||
Max. Panel Size: | 1150mm × 560mm | ||||||
Aspect Ratio: | 18:1 | ||||||
Surface Finish: | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger | ||||||
Special Process: | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
SMT: | Position accuracy:20 um | ||||||
Components size:0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |||||||
Max. component height:25mm | |||||||
Max. PCB size:680×500mm | |||||||
Min. PCB size:no limited | |||||||
PCB thickness:0.3 to 6mm | |||||||
PCB weight:3KG | |||||||
Wave-Solder: | Max. PCB width:450mm | ||||||
Min. PCB width: no limited | |||||||
Component height:Top 120mm/Bot 15mm | |||||||
Sweat-Solder: | Metal type :part, whole, inlay, sidestep | ||||||
Metal material:Copper, Aluminum | |||||||
Surface Finish:plating Au, plating sliver , plating Sn | |||||||
Press-fit: | Air bladder rate:less than 20% | ||||||
Press range:0-50KN | |||||||
Max. PCB size:800X600mm | |||||||
Testing: | ICT,Probe flying,burn-in,function test,temperature cycling |